
A diagram showing bulk micromachined silicon bonded on top of pyrex with a back side hole. The membrane deflection is measured by four piezoresistors forming a Wheatstone bridge to get the pressure from the back side hole. (Image courtesy of OCW.)
Instructor(s)
Prof. Jung-Hoon Chun
Prof. Sang-Gook Kim
MIT Course Number
2.008
As Taught In
Spring 2004
Level
Undergraduate
Course Description
Course Features
Course Description
This course introduces you to modern manufacturing with four areas of emphasis: manufacturing processes, equipment/control, systems, and design for manufacturing. The course exposes you to integration of engineering and management disciplines for determining manufacturing rate, cost, quality and flexibility. Topics include process physics, equipment design and automation/control, quality, design for manufacturing, industrial management, and systems design and operation. Labs are integral parts of the course, and expose you to various manufacturing disciplines and practices.
Other Versions
Other OCW Versions
OCW has published multiple versions of this subject.